Home Tech The New Technology Solutions For Advanced SiP Devices

The New Technology Solutions For Advanced SiP Devices


For many years, system-in-package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased complexity and higher package density for SiP devices has driven the development of new packaging technologies. In response, compartmental shield technology makes it possible to put several functions into a single SiP without interference among the chips, and double-side assembly technology greatly increases the chip density. More challenging requirements from customers in high technology markets require even further research into SiP technology. This report will discuss technologies that are currently being applied to SiPs and forecast what to expect in the future.


To better understand system-in-package (SiP) technology, it is necessary to review why SiP market share has dramatically increased, which areas require focus for future SiPs, and…

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